Untitled Document
Untitled Document
LED부문


COB세라믹기판
 관리자  | 2011·08·11 12:24 | HIT : 4,933 | VOTE : 317 |




Introduction


Ceramic substrate design concept of this section is to enable high power, small size, high brightness LED designed for use in the development of this section to replace the advantages of the system board, LED directly to the multi-chip package in the abovestars, and then by the second Optical lens more compact size make the product sizeand your area of ​​LED lighting products reduced, reduced materials, system cost, the cost of replacing the human assembly, packaging allows you to more quickly anddirectly to the chip Wire bonding to the substrate, plus The use of ceramic thermaleffect is excellent, even make your LED brighter longer life.

This product for the high-power LED package, such as: LED lights


Product:


Al2O3(3x3)- COB The thin film porcelain Ceramic Substrate


Al2O3(5X5)- COB The thin film porcelain Ceramic Substrate


AlN(7X7)-COB The thin film porcelain Ceramic Substrate


AlN(10X10)-COB The thin film porcelain Ceramic Substrate


Specification:


Transmit heat coefficient:Al2 O3- 21~23W/mk , AlN - 170~230W/mk


Palting: Au and Ag


Size:10mmx10mm(3x3) , 25mmx22mm(5x5) , 28mmx28mm(7x7) , 32mmx32mm(10x10)


Thickness:1mm~1.2mm


Load power:5 W~100 W

     
다이싱 자동설비, 다이싱 SAW
실리콘패드,led실리콘
실리콘렌즈 led렌즈
100W COB기판
COB세라믹기판
LED제품
HTCC 알루미나 기판
96% Al2O3 세라믹기판 관련
LED자동선별기
DPC공법 led용 세라믹기판(ceramic substrate)
LED Tapping M/C
방열판 Heat sink plate
1
Copyright 1999-2019 / skin by GGAMBO
Untitled Document